As SK hynix leads and Samsung lags, Micron positions itself as a strong contender in the high-bandwidth memory market for generative AI. Micron Technology (Nasdaq:MU) has started shipping samples of ...
TL;DR: SK hynix has introduced the world's first 16-Hi HBM3E memory, offering up to 48GB per stack, marking the highest capacity and layer count in HBM memory. This development follows NVIDIA's ...
Forbes contributors publish independent expert analyses and insights. This article discusses memory and chip and system design talks at the 2025 AI Infra Summit in Santa Clara, CA by Kove, Pliops and ...
The US government has imposed fresh export controls on the sale of high tech memory chips used in artificial intelligence (AI) applications to China. The rules apply to US-made high bandwidth memory ...
With the goal of increasing system performance per watt, the semiconductor industry is always seeking innovative solutions that go beyond the usual approaches of increasing memory capacity and data ...
Over the past two decades, the raw compute capability of processors used in high‑performance computing (HPC) and artificial intelligence (AI) systems has increased at an extraordinary pace. Figure 1 ...
The next generation of high-bandwidth memory, HBM4, was widely expected to require hybrid bonding to unlock a 16-high memory stack. A JEDEC move made that unnecessary with this generation, but it’s ...
JEDEC’s HBM4 and the emerging SPHBM4 standard boost bandwidth and expand packaging options, helping AI and HPC systems push past the memory and I/O walls. Why AI and HPC compute scaling is outpacing ...
As AI shifts from cloud training to edge inference, the memory stack is moving beyond data access toward system-level coordination, reshaping controller design, supply chain roles, and value ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results