Despite strong demand for AI-related memory products, the DRAM interface product and IP company plunged after a strong run.

TOKYO--(BUSINESS WIRE)--Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, today announced that it has delivered the industry’s first complete memory ...

JEDEC Solid State Technology Association, the global leader in standards development for the microelectronics industry, today announced milestones from its JC-40 and JC-45 Committees for Logic and ...

SAN JOSE, Calif.--(BUSINESS WIRE)--Rambus Inc. (NASDAQ: RMBS), a premier chip and silicon IP provider making data faster and safer, today announced the availability of its DDR5 Client Clock Driver ...

The company says that these innovative new products for RDIMMs and MRDIMMs "will seamlessly extend DDR5 performance with unparalleled bandwidth and memory capacity for compute-intensive data center ...

TL;DR: JEDEC has released the HBM4 DRAM standard, enhancing bandwidth up to 2 TB/s, doubling channels, and improving power efficiency and capacity for high-performance computing, AI, and graphics.

The central insight within the Q1 2026 Rambus (RMBS) data is a structural divergence between the broader artificial ...

Rambus beat earnings expectations and gave a rosy outlook for the fourth quarter. The company is continuing to benefit from AI-related memory demand and innovation. Positive news on Rambus came from ...

High Bandwidth Memory (HBM) is the commonly used type of DRAM for data center GPUs like NVIDIA's H200 and AMD's MI325X. High Bandwidth Flash (HBF) is a stack of flash chips with an HBM interface. What ...

New Multiplexed Registered Clock Driver, Multiplexed Data Buffer and PMIC Enable Next-Generation MRDIMM Speeds up to 12,800 Mega Transfers per Second for AI and High-Performance Compute Applications ...